What are the topics covered? There’s managing with pressures as an IC designer, the size of the advanced packaging market, NXP commenting on the EU chip plan, Canon planning to manufacture nanoimprint lithography (NIL) machines, and Arm laying off 20% of its UK workforce of 3,500 employees.
5. Viewpoint: The pressures on Integrated Circuit designers
“How do Integrated Circuit designers cope with increasing demands while maintaining a good work-life balance?” asks WIMMIC’s Technical Director, Ash Madni. If you feel like me in the above picture, don’t worry, we are not alone. In today’s commercial world of tight deadlines, technology nodes shrinking while silicon costs go up and the need to achieve right first time silicon, all place significant pressure on designers. To maximise our performance and to stay sharp not only requires honing our technical skills, but also how we look after our physical and mental health.
4. Advanced packaging to take 50% of the market by 2027
The advanced packaging industry is expected to have a 9.6% CAGR between 2021 and 2027 to $65 billion, says Yole Developpement. The advanced packaging segment as compared with traditional packaging market continues to increase, with more than 50% of the market by 2027. The highest advanced packaging market share belongs to the Flip-Chip platform, with 70% of the market in 2021. The highest CAGR is expected from ED , 2.5D/3D, and fan-out at 24%, 14%, and 11%, respectively.
3. EU chip plan would cost €500bn, says NXP CEO
The EU will need ten times more than its budget if it wants to get 20% of the world chip market by 2030, Kurt Sievers, CEO of NXP, told the Globalfoundries’ Technical Summit in Dresden. The EU has put forward a $52 billion Chips Act to hike European market share from 10% to 20%. “We have calculated that we would need €500 billion investment in Europe to reach the 20% market share goal formulated in the EU Chips Act,” said Sievers, “reaching 20% world market share coming from 10% requires tripling or quadrupling our capacities.”
2. Canon to build nanoimprint factory to challenge ASML
Canon is to build a factory to manufacture nanoimprint lithography (NIL) machines which it sees as a competitor to EUV, reports the Nikkei. Canon reckons that manufacturing costs using NIL will be up to 40% less than using EUV and that power consumption using NIL will be 90% less that that used by EUV. The prize for Canon is that NIL breaks ASML’s monopoly on leading edge litho machines.
1. Arm chops staff
Arm has laid off 20% of its UK workforce of 3,500 employees and 18% of its global workforce of 6,950 people. 700 UK jobs have gone – representing 40% of the 1,730 people hired since Softbank bought the company in 2016 promising to double the UK workforce. In 2016 Arm had 1,770 employees. Before this year’s lay-offs that had risen to 3,500. Outside the UK, 550 people have been laid off.